In the additive process, only the conductor pattern is chemically copper-plated on insulating base material. This represents the theoretical ideal for the production of printed circuit boards. In one variant, the special base material is catalyzed over its entire surface. Before chemical copper plating, all parts that are not part of the conductive pattern are covered with a mask. In the other variant, the conductive pattern is activated photochemically. The required copper layer thickness is then deposited without external current. The treatment time for chemical copper plating, the uncontrolled growth and the process management pose problems.